Publicaciones

Affichage de 4481 à 4490 sur 16077


  • Article dans une revue

Numerical Modelling of Vibration Characteristics of a Partially Metallized Micro Electromechanical System Resonator Disc

Ismail Naciri, Abdessamad Rguiti, Lahoucine Elmaimouni, Jean-Etienne Lefebvre, Faniry Emilson Ratolojanahary, J. G. Yu, Youssef Belkassmi, Ali El Moussati

In this paper, we report an extension of a polynomial and numerical vibrational characterization of an annular piezoelectric disc resonator partially covered with electrodes. The three governing partial differential equations of motion are solved to provide the frequency response of the...

Acta Acustica united with Acustica, 2019, 105 (6), pp.1164-1172. ⟨10.3813/AAA.919393⟩. ⟨hal-03148966⟩

  • Article dans une revue

Biomimetic surface modifications of stainless steel targeting dairy fouling mitigation and bacterial adhesion

Sawsen Zouaghi, Séverine Bellayer, V. Thomy, Thomas Dargent, Yannick Coffinier, Christophe André, Guillaume Delaplace, Maude Jimenez

Food and Bioproducts Processing, 2019, 113, pp.32-38. ⟨10.1016/j.fbp.2018.10.012⟩. ⟨hal-02322038⟩

  • Article dans une revue

3D Patterning of Si by Contact Etching With Nanoporous Metals

Stéphane Bastide, Encarnacion Torralba, Mathieu Halbwax, Sylvain Le Gall, Elias Mpogui, Christine Cachet-Vivier, Vincent Magnin, Joseph Harari, Dmitri Yarekha, Jean-Pierre Vilcot

Nanoporous gold and platinum electrodes are used to pattern n-type silicon by contact etching at the macroscopic scale. This type of electrode has the advantage of forming nanocontacts between silicon, the metal and the electrolyte as in classical metal assisted chemical etching while ensuring...

Frontiers in Chemistry, 2019, 7, pp.256. ⟨10.3389/fchem.2019.00256⟩. ⟨hal-02409484⟩

  • Communication dans un congrès

A method to determine wide bandgap power devices packaging interconnections

Loris Pace, N. Defrance, Jean-Claude de Jaeger, Arnaud Videt, Nadir Idir

Wide Bandgap (WBG) power devices show very good characteristics for high frequency operation in power converters, leading to a better power integration by reducing size and weight of passive components. Access parasitics such as resistances and inductances related to packaging and interconnections...

23rd IEEE Workshop on Signal and Power Integrity (SPI), Jun 2019, Chambery, France. pp.1-4, ⟨10.1109/SaPIW.2019.8781641⟩. ⟨hal-03276911⟩

  • N°spécial de revue/special issue

History of Machines and Mechanisms [Special Issue]

Marco Ceccarelli, Raffaele Pisano

Advances in Historical Studies, 8 (1), 2019. ⟨hal-04511002⟩