Publications

Affichage de 3201 à 3210 sur 16133


  • Chapitre d'ouvrage

15 - Silicon Nanowires and Nanopillars for Photovoltaic

Yan Pennec, Abdellatif Akjouj, Gaëtan Lévêque, Bahram Djafari-Rouhani, L. Dobrzynski

We present simulations on both the optical properties and the efficiency of nanowires (NWs), nanopillars (NPs) and nanocones (NCs) silicon-based solar cells, together with measurements on their associated optical absorption. We address the calculation using Green's function formalism and…

Photonics, Part 2: Photonic Circuits, Elsevier, pp.393-418, 2021, 978-0-12-819388-4. ⟨10.1016/B978-0-12-819388-4.00025-3⟩. ⟨hal-03359906⟩

  • Chapitre d'ouvrage

20 - Omnidirectional Bandgaps and Selective Transmission in Layered Photonic Crystals

Abdellatif Akjouj, El Houssaine El Boudouti, L. Dobrzynski, Bahram Djafari-Rouhani

It has been shown that a one-dimensional periodic structure such as a layered photonic crystal can exhibit the property of omnidirectional reflection, which means that any incident wave launched from the vacuum (or from a substrate) will undergo a total reflection at the layered photonic crystal…

Photonics, Part Three: Photonic Materials, Elsevier, pp.569-586, 2021, 978-0-12-819388-4. ⟨10.1016/B978-0-12-819388-4.00031-9⟩. ⟨hal-03360011⟩

  • Communication dans un congrès

Polydimethylsiloxane micro-channels application for the study of dynamic wetting of nano-etched silicon surfaces based on acoustic characterization method

Abbas Salhab, Julien Carlier, Pierre Campistron, M. Neyens, Malika Toubal, Bertrand Nongaillard, V. Thomy

Efficient cleaning of contaminations in the semiconductor industry is a determining factor in ensuring the good quality of the electronics products. We present here the dynamic wetting characterization of a fluid on top of Deep Trench Isolation (DTI) structures using ultra-high frequency acoustic…

15th International Symposium on Ultra Clean Processing of Semiconductor Surfaces, UCPSS 2021, Session 6 - Wet processing in narrow spaces and pattern collapse, Apr 2021, Virtual, Unknown Region. pp.143-149, ⟨10.4028/www.scientific.net/SSP.314.143⟩. ⟨hal-03362264⟩

  • Article dans une revue

Mm-wave through-load element for on-wafer measurement applications

Marc Margalef-Rovira, Olivier Occello, Abdelhalim Saadi, Vanessa Avramovic, Sylvie Lepilliet, Loïc Vincent, Manuel J. Barragan, Emmanuel Pistono, Sylvain Bourdel, Christophe Gaquière, Philippe Ferrari

This paper presents an innovative Through-Load element aimed at characterization applications at mm-wave frequencies. The proposed structure can behave as a Through connection or as a 50-Ω load depending on a DC control voltage. Among other potential applications, this system can be used to…

IEEE Transactions on Circuits and Systems I: Regular Papers, 2021, 68 (8), pp.3170-3183. ⟨10.1109/TCSI.2021.3072097⟩. ⟨hal-03202213⟩