Publications
Affichage de 13251 à 13260 sur 16271
Reactive ion etching of a 20 nanometers tungsten gate using a SF$_6$/N$_2$ chemistry and hydrogen silsesquioxane hard mask resist
G. Larrieu, Emmanuel Dubois
Journal of Vacuum Science and Technology, 2005, 23 (5), pp.2046-2050. ⟨10.1116/1.2050654⟩. ⟨hal-00125635⟩
Formation of nano-domains in SAMs of long chain alkyltrichlorosilanes deposited on silicon
S. Desbief, L. Patrone, D. Goguenheim, D. Vuillaume
8th European Conference on Molecular Electronics, ECME8, 2005, Bologna, Italy. ⟨hal-00125600⟩
Piezoelectric micro-machined ultrasonic transducer (pMUT) for energy harvesting
Karim Dogheche, B. Cavallier, P. Delobelle, L. Hirsinger, S. Ballandras, Eric Cattan, Denis Remiens, M. Marzencki, B. Charlot, Skandar Basrour
Ultrasonics Symposium, 18-21 Sept., Sep 2005, Rotterdam, Netherlands. pp.939 - 942, ⟨10.1109/ULTSYM.2005.1603005⟩. ⟨hal-00079975⟩
Close infrared thermography using an intensified CCD camera : application in nondestructive high resolution evaluation of electrothermally actuated MEMS
B. Serio, J.J. Hunsinger, F. Conseil, P. Derderian, D. Collard, L. Buchaillot, M.F. Ravat
2005, pp.819-829. ⟨hal-00147502⟩
Terahertz radiation from heavy-ion-irradiated In0.53Ga0.47As photoconductive antenna excited at 1.55 µm
N. Chimot, J. Mangeney, L. Joulaud, P. Crozat, H. Bernas, K. Blary, Jean-Francois Lampin
Applied Physics Letters, 2005, 87, pp.193510-1-3. ⟨hal-00162806⟩
Optimisation de la correction de biais dans le récepteur PIC multi-étages pour le système CDMA
M. Moussaoui
2005. ⟨hal-00162808⟩
Terahertz emission from nanometric HEMTs analyzed by noise spectra
J.F. Millithaler, L. Varani, C. Palermo, J. Mateos, T. Gonzalez, S. Perez, D. Pardo, W. Knap, J. Lusakowski, N. Dyakonova, S. Bollaert, A. Cappy
Terahertz emission from nanometric HEMTs analyzed by noise spectra, 2005, Salamanca, Spain. pp.335-338, ⟨10.1063/1.2036763⟩. ⟨hal-00154896⟩
High performances of InP channel power HEMT at 94 GHz
F Medjdoub, M. Zaknoune, X. Wallart, Christophe Gaquière, D. Theron
Electronics Letters, 2005, 41, pp.1406-1408. ⟨hal-00154912⟩
Air-bridge interconnection and bondpad process for non-planar compound semiconductor devices
G. Ulliac, S. Garidel, Jean-Pierre Vilcot, P. Tilmant
Microelectronic Engineering, 2005, 81, pp.53-58. ⟨hal-00125664⟩
Nouveaux microcapteurs thermiques en technologie silicium pour des applications en automobile
M. Haffar, M. Ait-Hammouda Yala, K. Ziouche, P. Godts, Didier Leclercq
Galerie de la Recherche et de l'Innovation, 2005, Marcq en Baroeul, France. ⟨hal-00126736⟩