Publications
Affichage de 12841 à 12850 sur 16271
Micro et nanomécanique, MEMS et NEMS
Bernard Legrand, L. Buchaillot, D. Collard
Ecole CNRS : Nanosciences et Nanotechnologies, 2006, Autrans, France. ⟨hal-00128667⟩
Micro-machined actuators for the friction driven micro-motor
Bernard Legrand, L. Buchaillot, D. Collard
2006, pp.211-214. ⟨hal-00128670⟩
BCH coding performance evaluation on a land mobile channel based OFDM system
A. Seddiki, A. Djebbari, Jean-Michel Rouvaen, Abdelmalik Taleb-Ahmed
Information Technology Journal, 2006, 5, pp.930-936. ⟨hal-00128167⟩
Carbon nanotube field-effect transistor for GHz operation
Jean-Marc Bethoux, Henri Happy, Gilles Dambrine, Jean-Sébastien Borghetti, Vincent Derycke, M. F. Goffman, Jean-Philippe Bourgoin
European Solid-State Device Research Conference, Sep 2006, Montreux, Switzerland. pp.206-209, ⟨10.1109/ESSDER.2006.307674⟩. ⟨hal-00128189⟩
Optimisation conjointe source/canal de la qualité vidéo dans un contexte de transmission sur ligne ADSL
C. Goudemand, François-Xavier Coudoux, Marc G. Gazalet
Journées Codage conjoint et canal radioélectrique, GDR ISIS, 2006, Paris, France. ⟨hal-00128170⟩
Modélisation des propriétés statiques et dynamiques de milieux ferroélectriques de dimensions finies
Laurent Baudry
2006. ⟨hal-00128186⟩
Molecular-scale electronics : status and perspectives
D. Vuillaume
2nd International Nanotechnology Conference, NSF-NNI, 2006, Arlington, United States. ⟨hal-00127158⟩
Theoritical description of ferroelectric and pyroelectric hystereses in the disordered ferroelectric-seminconductor films
A.N. Morozovka, E.A. Eliseev, Denis Remiens, S. Soyer
Journal of Applied Physics, 2006, 100, pp.014109-1-12. ⟨hal-00138708⟩
A Bi-stable Micro-machined Piezoelectric Transducer for Mechanical to Electrical Energy Transformation
Karim Dogheche, B. Cavallier, P. Delobelle, L. Hirsinger, Eric Cattan, Denis Remiens, M. Marzencki, B. Charlot, Skandar Basrour, S. Ballandras
Integrated Ferroelectrics, 2006, 80, pp.305-315. ⟨10.1080/10584580600659878⟩. ⟨hal-00135742⟩
Fabrication of 1mm3 size zero-level packaging using wafer-level BCB bonding and glass wet-etching technique for devices MEMS
S. Seok, N. Rolland, P.A. Rolland
2006, pp.53-54. ⟨hal-00147518⟩